Canteliver Probe Card
MPI Cantilever Probe Card is broadly utilized on gold bump and pad wafer tests for display driver, logic, and memory product. MPI’s cantilever probes will be the corresponding respond to for the calls for of fine pitch, compact pad dimension, large pace, much less cleaning, multi-DUT, significant pin depend, and ultra-very low leakage needs. With remarkable craftsmanship, modern architecture and proven methodologies based upon mechanical and electrical simulation/measurement success, making MPI the top cantilever provider globally.
FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) desire. FCB can be a established Resolution for many different semiconductor manufacturing tests from early engineering pilot-operates to substantial volume manufacturing (HVM). FCB is prepared for system requiring high sign integrity probing (SI) and/or electrical power integrity probing (PI). Applications include slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the whole world’s finest All round cost-of-possession (COO) for different DUT purposes.
EVS Probe Card
The EVS Probe Card is really an enhancement about the traditional buckling beam probe card. Key characteristics are greater present-day carrying capability (C.C.C.) and lower well balanced Get in touch with pressure (BCF), in addition to In general MEMS-like qualities. EVS can certainly meet the prerequisite of advanced wafer probing. Exact alignment and excellent planarity Management are the essential things contributing to stable Get hold of resistance. With its capacity and effectiveness, EVS Probe Card is a perfect choice for Highly developed probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for at any time finer pitch. It's created for scaled-down Al pad, and is ideal for small pitch application with peripheral and whole array sample. With specific alignment and much better planarity Handle, Osprey can access bigger productivity by multi-DUT design and style. The forming wire (FW) variety needle generated with MPI’s own micro fabrication procedure not just delivers large-good quality effectiveness but will also allows easy needle replacement and shortens sustaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of reduced force probing. Additionally, it comes with a chance to fulfill substantial C.C.C. and substantial pin counts application. The MEMS procedure guarantees highly consistent needle properties, as well as Exclusive construction style enables specific alignment check here and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/